Mechanical Modeling Engineering Intern (4609)
Qorvo is All Around You! We manufacture innovative RF solutions at the center of connectivity to enable high-performance applications for advanced wireless devices, wired and wireless networks and defense radar and communications for 5G networks, cloud computing, the Internet of Things, and other emerging applications. We are a global company thriving on a culture of innovation, diversity, and inclusion. Our people are always at the core of Qorvo’s innovation. Qorvo is a place to stretch your imagination and push boundaries to achieve success. Learn more about Top 10 Reasons to make a career at Qorvo.
Qorvo’s Internship Program is designed for college students currently enrolled in an accredited Bachelor’s, Master’s, or PhD program. Qorvo offers real work experience, exposure to upper management, and the opportunity to pursue full time opportunities, as available.
Qorvo’s Internship Program offers:
- Mentorship Program
- Lunch and Learn Series
- Team based work environment
- Formal evaluation process with real time feedback
- Networking and social opportunities
- Meaningful assignments with a final presentation
Job Summary:
The Mechanical Modeling Intern will be exposed to full process flow for semiconductor assembly packaging with emphasis on mechanical and thermal FEA modeling of products, packages, and semiconductor technologies.
Responsibilities:
- Learn best in class industry “know-how” to enable continued global leadership of Qorvo packaging solutions.
- Work with FEA simulation tools to optimize products, packages, and technologies.
- Depending on candidate experience, projects will be selected from the following areas:
- Thermal FEA Modeling of products.
- Mechanical FEA stress modeling of products.
- Materials characterization.
- Improvement of modeling techniques and automation.
Qualifications:
- BS in Mechanical Engineering, Physics, or Materials Science.
- Knowledge of solid mechanics and heat flow physics.
- Experience using FEA software tools.
- Collaborative with strong communication skills.
- Problem solving methodology.
- Program management / time management skills.